Sputter Target Bonding Process
NanoBonding with NanoFoil® is performed in air at room temperature. The backing plate is laid flat with the pre-tinned surface up. NanoFoil is then placed on top of this solder surface. The NanoFoil can be in the form of a single piece for smaller sputter targets or as a pre-assembled array for larger sputter targets. The pre-tinned target is then positioned over the NanoFoil and aligned correctly with the backing plate. A cross-section of this layout is shown schematically below.
Once the backing plate, NanoFoil and target are correctly positioned, pressure is applied to the assembly. The reaction in the NanoFoil is initiated by an electrical impulse (at multiple points simultaneously for large targets) and is complete in a few milliseconds.
The heat generated by the NanoFoil reflows the solder layers on the backing plate and the target and a bond is instantly formed. The bond is stress-free since the backing plate and target experience little heating during the bonding operation.
