Sputter Target Bonding Product Specifications
NanoBond® of Metal Sputtering Targets
The bonding with NanoFoil® (NanoBond®) of the following metal sputter targets is considered a standard product provided the requirements listed below are met. The standard backing plate material is copper. Bonding to the other backing plate materials such as aluminum, molybdenum and stainless steel is also possible.
Metals to which solder is applied with the aid of flux:
Cobalt, Copper, Copper-Silver alloys, Nickel, Nickel-Iron alloys, Platinum, Ruthenium.
Metals to which solder is applied with the aid of mechanical agitation:
Aluminum, Aluminum Alloys including Aluminum-Copper, Aluminum-Silicon and Aluminum-Neodymium
Metals to which solder is applied with the aid of ultrasound*:
Aluminum-Titanium alloys, Chromium**, Iron-Cobalt, Manganese, Manganese-Iridium, Molybdenum, Nickel-Chrome, Nickel-Titanium, Niobium, Stainless Steel, Tantalum, Titanium, Titanium-Niobium, Tungsten, Tungsten-Titanium.
Metals to which no additional solder is applied:
Tin
NanoBond® of Ceramic Sputtering Targets
The bonding with NanoFoil (NanoBond) of the following ceramic and brittle non-ceramic (Silicon, Carbon) sputtering targets is considered a standard product, provided the requirements below are met. The standard backing gplate material is copper, unless otherwise stated. Bonding to other backing plate materials such as aluminum, molybdenum and stainless steel is possible.
Ceramics to which solder is applied with the aid of ultrasound:
Aluminum Oxide (Al2O3), Aluminum Zinc Oxide (AZO), Boron Carbide (B4C), Borosilicate Glass, Carbon / Graphite, HafniumOxide, Indium Tin Oxide (ITO), Silicon bonded to copper, Silicon bonded to molybdenum, Silicon Carbide (SiC),Silicon Dioxide (SiO2), Titanium Carbide (TiC), Titanium Nitride (TiN), Zinc Oxide (ZnO)
