Sputtering Target Bonding
NanoFoil® and NanoBond® simplify the sputtering target bonding process, allowing target bonders and target manufacturers to make reliable and repeatable bonds while increasing margins and lowering capital expenditures.
Features of NanoFoil® in Target Bonding:
- Room temperature bonding
- Uniquely well-suited to bonding materials with dissimilar CTEs
- Lowers overall cost of solder bonding process: materials, capital expenditures, and personnel
- Uniform bondline thickness
- Compatible with any solder
- Minimized stress from CTE mismatch
- Adopted for bonding applications requiring the higher precision demanded by the semiconductor industry
- Minimal voiding – up to 99% coverage
- Lowers overall cost of materials, capital expenditures, and personnel
- Any size target can be NanoBonded
Globally, target manufacturers, bond shops, and end users have realized the potential of NanoBonded sputtering targets.
NanoFoil® significantly improves existing planar target bonding methods through the use of localized heat. When activated, NanoFoil® delivers localized heat that bonds similar or dissimilar materials in just a fraction of a second, in any environment, therefore eliminating the need for a standard furnace, torch, or laser. The rapid and versatile nature of this novel bonding method offers process cost reductions over traditional bonding methods.
NanoBonding results in Flat & Parallel Assemblies
Maximum Y Deflection: 0.68 mm
Maximum Y Deflection: 0.038 mm
Residual stresses and deflections from NanoBonded targets are an order of magnitude less than conventional bonding [Von Mises Stress (MPa)].
NanoBond® produces a strong, flat, low stress bond that is highly thermally and electrically conductive. NanoFoil® works by acting as a local heat source to melt adjacent solder layers without heating the target or backing plate materials. This allows the bonding of nearly any combination of sputtering target material and backing plate material, including ceramics to metals, irrespective of the difference in coefficient of thermal expansion (CTE). This process, called NanoBond®, requires no expensive equipment and can be integrated into any process.
Indium Corporation offers NanoBonding services in our target bond shop located in Utica, NY. Let our team of trained, professional target bonders NanoBond® your targets. We routinely bond targets for the solar and semiconductor industry.
Sputtering Target Bonding Technical Documents
Product Data Sheets
Material Safety Data Sheets
Sputtering Target Blog Posts
Whenever two materials with different coefficient of thermal expansion values are bonded together, they will expand and contract as the temperature changes. Assuming these two materials are bonded rigidly, there are two things that can happen as the temperature changes: 1) the bond will break apart…
In an earlier post I mentioned one of the presentations we gave at the 2013 SVC TechCon. The other presentation that our team delivered at the show (presented by Jacques Mateau) regarded another very interesting topic. The paper, High Temperature, Pb-Free, Metallic Sputtering Target Bonding…
For anyone who couldn’t make it to the 2013 SVC, just email me at email@example.com and I can make sure you receive a copy of “Eliminating the Bond Stress of Sputtering Targets at Operating Temperatures”. This paper discusses alternative processes for bonding targets - alternative…
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