Pb-Free QuickStart®
The Proven Pb-Free Assembly Program
Now, Motorola and Indium Corporation offer a jointly-developed, process-proven, lead-free assembly solution using NC-SMQ230 with Indalloy241® Solder Paste.
Benefits:
- Brings your Pb-Free product to market quickly
- Eliminates cost of product and process development
- Provides identification of critical process variables for Pb-Free implementation
- Access to more than 2 years of Research and Development data
- Identifies the pitfalls in a Pb-Free production environment and how to avoid them before they cost you money
Features:
- Documented NC-SMQ 230 operating characteristics
- Design of Experiments for Pb-Free interconnect assemblies
- Solder paste print performance parameters
- Visual expectations for post-reflow boards
- Wetting expectations for various materials
- Pad and stencil design recommendations and guidelines
- Optimized profile development
- Addresses electrical and mechanical performance of Pb-Free interconnections
- On- and off-site technical support for process issues post-implementation
