NF260 - The world's FIRST reworkable, Pb-Free No-Flow Underfill

It’s A “Three-peat”!!! Indium Corporation Earns Coveted EMAsia Innovation Award

EMAsia magazine’s coveted Innovation Awards were presented recently at NEPCON Shanghai. Indium’s NF260 earned top honors in the adhesives and underfills category. Shown here are Rick Short and William Aw accepting the award on the company’s behalf.

This “three-peat” makes it a clean sweep for NF260. With this honor it has now earned the top spot in North America (SMT Vision Award), Europe (Global SMT Product Innovation Award), and Asia (EMAsia Innovation Award). A triple play!

NF260 is readily available for sampling and sales. Contact Jim Hisert with any questions regarding the most honored and respected underfill in the world.

Photo of Dr. Lee and Ross Berntson accepting Vision Award

Vision Award - Dr. Lee and Ross Berntson accepting the prestigious Vision Award for the revolutionary NF260 no-flow underfill.

TECHNOLOGY DEMANDS

Two trends are converging, driving the need for advanced PCB assembly materials:

Pb-Free – Higher soldering temperature renders no-flow underfilling increasingly difficult, while greater solder rigidity renders underfilling more necessary.
Miniaturization & Portability – Portability demands greater crack-resistance in drop tests and rough usage, hence a greater need for underfilling.

COST SAVINGS

NF260 enhances the cost/performance ratio as it integrates seamlessly with existing SMT processes:

Dispense – performs in virtually any positive displacement or auger type system .
Placement – accommodates existing automated component placement equipment.
Reflow – processed using typical Pb-Free reflow profiles in an air environment. The use of typical profiles is critical for integration with existing SMT lines. The ability to reflow in air, and eliminating nitrogen environments, is key to controlling costs.
Repair – reworkable in typical SMT rework systems. Tremendous cost savings can be realized when defective components can be replaced easily.
Cleaning – eliminates the need for residue cleaning prior to application of an underfill.

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QUALITY & RELIABILITY

NF260 has demonstrated durability in thermal cycling (>2,500 cycles with no failures) and thermal shock testing. However, the most striking reliability gain was observed in aggressive drop tests, which included an edge-weighted board to force the most difficult impact orientation. NF260 repeatedly exceeds endurance expectations, with no failures in > 450 tests. Under similar conditions, unfilled soldered connections typically fail after fewer than 10 drops.