Triple award-winning No-Flow Underfill
Designed for BGA and Chip Scale Package (CSP) assembly
Processes in a single reflow process
Provides both a fluxing and underfilling capability for the component
Provides increased reliability and environmental protection
Integrates seamlessly with existing SMT processes
Reduces costs
Enhances finished goods performance & reliability
Provides precise amounts of solder in the exact location needed
Enhances solder joint strength only where needed
Reduces flux residues in solder joint fortification applications
Cost savings:
eliminates the need for dispensing extra solder paste to achieve additional volume
utilizes existing process equipment (no need for capital investment)
Address thermal performance issues caused by:
increased power
reduced component size
Available in several forms, including:
preforms
paste
ribbon
foil
wire
Enhance finished goods performance & reliability
