Low-voiding under BGAs with microvia-in-pad technology
Excellent printability minimizes the downtime on assembly lines and ensures consistently reliable results
The industry's best "response-to-pause" printing performance
Robust reflow window
Performs well in both high-volume and high-mix surface mount assembly processes
Completely halide-free
Reduces solder beading under passive components
Reduces flux spattering onto gold finger contacts
Industry-proven (>150,000,000 mobile phones made with this product)
Reflows extremely well at low peak temperatures (229°C) to allow minimal thermal impact on boards and components
Formulated for use with Indium-based alloys
Provides alternative solder alloy options for applications in which standard SAC alloys are not suitable
Exceptional printing
Long stencil life
Wide reflow profile window
Excellent cleanability - even at elevated reflow temperatures
Consistent fine-pitch printing performance
High transfer efficiency from stencil apertures
Superior fine-pitch soldering ability
Excellent "response-to-pause" printing performance
Low-voiding
