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PCB Assembly

Home » Applications » PCB Assembly

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PCB Assembly
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  • Thermal Management
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PCB Assembly Technical Documents

Whitepapers

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Challenges of Miniaturization

Authors: Dr. Ronald C. Lasky

Posted on 4 Mar 2010

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Down-Selecting Low Solids Fluxes for Pb-free Selective Soldering

Authors: Mario Scalzo, Todd O, Todd O'Neil

Posted on 11 Apr 2011

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Solder Preform Basics (English)

Authors: Paul Socha

Posted on 9 Mar 2010

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Indium Corporation Blog Posts

The Perfect Sputtering Target Bond

Thursday, May 23, 2013 by Jim Hisert [view bio]

Why do we care so much about target bonding? This is important because a sputtering target that truly performs will allow greater process flexibility, and higher throughput. An introduction from Eliminating Bond Stresses of Sputtering Targets at Operating Temperatures: “…It was observed…

Bonded Sputtering Targets are a Bi-Metallic Assembly

Tuesday, May 21, 2013 by Jim Hisert [view bio]

Whenever two materials with different coefficient of thermal expansion values are bonded together, they will expand and contract as the temperature changes. Assuming these two materials are bonded rigidly, there are two things that can happen as the temperature changes: 1) the bond will break apart…

NanoBond® is a Fluxless Process

Thursday, May 16, 2013 by Jim Hisert [view bio]

Fluxes are an interesting element of working with many solder applications. With so many specialized fluxes there is usually a perfectly-tailored flux for removing oxides from any solderable surface. Even though we love fluxes at Indium Corporation – not all of our customers share that same affection. It…

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