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Indium Corporation Blog Posts
Reversing the Effects of CTE Mismatch
Coefficient of Thermal Expansion (CTE) differences between materials can really cause problems when those materials are rigidly bonded. If you’ve ever seen a bi-metallic strip test in science class, you’ll remember that it is usually demonstrated with 2 thin materials that are flat at room…
Reflow of Copper Pillar Microbumps
Waferbumping processes have evolved in the last 10 years. The semiconductor assembly industry has gone from bumping processes using solder paste printing (with all its concerns of voiding, coplanarity, stencil-life, and spatter) to plated solderbumps, and now to plated copper pillars with microbumps…
The Limits of Mixing: A Chocolate Chip Example
Folks, We tend to think of mixing as something that can completely even out those things being mixed. As an example, let’s assume you are making chocolate chip cookies and would like to have 10 chocolate chips in each large cookie. You make enough batter for 100 cookies and then…
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