PCB Assembly Technical Documents
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Indium Corporation Blog Posts
Visit Indium Corporation at APEX 2018 in San Diego, CA February 27th through March 1st.
Dr. Robert Ploessl, Manager of Marketing and Technology Assessment and Product Manager, Compounds, gives Phil Zarrow an overview of what Cpk and Cpu mean in relation to calculating the purity of Indium Corporation compounds and how it differs from calculating Cpk and Cpu in assembly processes.
Kim Flanagan, Technical Support Engineer, and Phil Zarrow discuss how to Avoid the Void® by looking at four non-QFN void types—Kirkendall (champagne), shrinkage, via-in-pad, and blowhole—and how to decide if voiding is a defect or a symptom.
From One Engineer to Another®
All of Indium Corporation’s products and solutions are designed to be commercially available
unless specifically stated otherwise.