Package-on-Package (PoP) assembly is most commonly carried out by printing solder paste onto the substrate and placing the logic chip into the paste. The memory package is then either dipped into a specially-designed PoP flux or solder paste and placed on top of the logic chip. The whole assembly is then reflowed. No-clean processes are used.
Package-on-Package Flux Technical Documents
Product Data Sheets
Safety Data Sheets
Package-on-Package Blog Posts
The 46th International Symposium on Microelectronics will be held in Orlando, Florida, September 30th through October 3rd, 2013. I will be attending both as as an exhibitor and as a session co-chair. TECHNICAL SESSION: This year there will be 6 technical tracks: Interposers & 2.5/3D Packaging Modeling,…
Graping Defect是由一家著名手机公司定义的defect. 大致是这样：由于微型化 miniaturization, 元器件更小了，0201 甚至 01005， 所使用的焊锡膏的粉末球半径也更小了， 由以前的3号粉， 到现在的4号， 4.5号，甚至5号5.5号粉。 在相同体积的焊锡膏中，…
When designing a Package-on-Package (PoP) assembly process, there are many variables that need to be considered in order to be successful. While the chemistry of your PoP dipping flux or paste plays a major role in PoP assembly, there is also much to consider in terms of the components, equipment,…
Senior Product Manager, Engineered Solders
From One Engineer to Another®
All of Indium Corporation’s products and solutions are designed to be commercially available
unless specifically stated otherwise.
Indium Corporation — ©1996–2014. All Rights Reserved. | Site Map