"Best in Session" technical paper award, IMAPS 2012, "High Reliability, High Melting Lead-Free Mixed BiAgX Solder Paste System", Dr. Ning-Cheng Lee.
Corporate Awards
"Best Soldering Paper" at the 5th International Brazing and Soldering Conference (IBSC), hosted by ASM International and the American Welding Society on April 22-25, 2012, in Las Vegas, Nevada.
"Best Presentation of Technology Conference One", Dr. Ning-Cheng Lee, NEPCON China (Shanghai) 2011, Surface Mount Technology Association (SMTA) China East.
"Components, Packaging, and Manufacturing Technology Society (CPMT) Electronics Manufacturing Technology Award", IEEE, Dr. Ning-Cheng Lee, for his contributions to electronics manufacturing technology.
LED Journal's "Innova Award", for Heat-Spring® thermal interface material. This award recognizes, "leading companies within the LED market which have shown, through their products and services, the most innovative and advanced technology breakthroughs in LEDs.", May 2010.
"Engineering Company of the Year", Mohawk Valley Engineers' Executive Council (MVEEC), 2010.
Earned Samsung Corning Precision Glass’s Superior Vendor Award, 2010.
Earned Shinwa’s 2009 Best Supplier Award, 2010.
Earned Celestica’s 2009 Total Cost of Ownership Supplier Award for Product Innovation, 2010.
Earned Intel’s Quality Operating System Award for first two quarters of 2009.
Earned Intel’s 2007 Preferred Quality Supplier Award for outstanding performance in providing Thermal Interface Material products and services, 2008.
Greg Evans, Indium Corporation President, is honored with the SMTA Founder’s Award, 2005.
Honored with award for outstanding performance in quality and service as a supplier to a major battery manufacturer, 2004.
Earned New York State Governor’s Award for Achievement in Exporting, 1988.
Awarded US Army/Navy "E" Award for Manufacturing Excellence, 1942.
Frost & Sullivan Award
Indium has earned its fourth Frost & Sullivan Award for SMT Solder Paste Customer Value Enhancement in 2006.
According to Frost & Sullivan, awards are presented to companies "for exhibiting a superior knowledge of customer needs and the ability to exceed customer expectations." Indium Corporation was chosen to receive the award based on an in-depth analysis of market competitors, and interviews with companies that make up the SMT soldering materials industry.
"These awards are special because they are presented by the largest and most respected research firm in the world," said Rick Short, Director of Corporation Communications. "It is truly a tribute to the global Indium Corporation team."
Previous Frost & Sullivan Awards include:
- 2003: Product Innovation Award for the development of NC-SMQ230 Pb-Free Solder Paste
- 2000: Market Engineering Customer Service Leadership Award for developments in the solder paste and adhesive markets
- 1998: Market Engineering Customer Service Leadership Award for developments in the solder paste and adhesive markets
Triple Awards for NF260 No-Flow Underfill
Indium Corporation’s introduced the world’s first Pb-Free, Reworkable, Air-Reflowable, No-Flow Underfill, called NF260, in 2005. Since its introduction Indium’s NF260 No-Flow Underfill has won awards on three continents for its quality and innovation, as well as its ability to enhance customers’ finished goods reliability and cost savings.
China - EM China Innovation Award was presented at Nepcon Shanghai (Shanghai, China) in 2006
North America - SMT Vision Award was presented at IPC/APEX (Anaheim, California, USA) in 2006
Europe - Global SMT Technology Award for Innovation was awarded at Productronica (Nuremberg, Germany) in 2005
From One Engineer to Another®
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