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Recent News and Press Releases

Posted on 18 Jun 2013

Indium8.9HFA Solder Paste Sees Accelerated Adoption for Miniaturized Assemblies

Indium Corporation’s Indium8.9HFA Solder Paste is a versatile, halogen-free, Pb-free, solder paste with leading print performance on miniaturized components. Assemblers and OEMs are adopting this remarkable new product at an accelerating pace. Print performance is especially critical for manufacturers of mobile phones and other personal electronics devices as they struggle… Read Full Article

Posted on 4 Jun 2013

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Indium Corporation Technology Expert to Deliver Webtorial on Top Pb-free PCB Assembly Defects

Tim Jensen

Indium Corporation’s Tim Jensen, Product Manager – PCB Assembly Materials, will present a two-part webtorial, titled Top Pb-Free PCB Assembly Defects: Cause and Cure, as part of a webtorial series sponsored by the SMTA. The webtorials are scheduled from 1-2:30 p.m. EDT on June 11 and 25. This two-part webtorial… Read Full Article

Posted on 30 May 2013

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Indium Corporation Technical Support Engineer to Participate in Session at SMTA Space Coast

Ed Briggs

Indium Corporation’s Ed Briggs, Technical Support Engineer, Southeast USA and Eastern Canada, will participate in the Solder Joint Failure Analysis session at the Surface Mount Technology Association’s Space Coast Expo and Tech Forum June 13 in Melbourne, Florida. The Solder Joint Failure Analysis session will explore analysis methods that will… Read Full Article

Posted on 29 May 2013

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Indium Corporation Technology Expert to Present at IPC Medical Devices Conference

Dr. Ning-Cheng Lee

Indium Corporation’s Dr. Ning-Cheng Lee, Vice President of Technology, will present at IPC’s Innovations in Electronics Manufacturing for Medical Devices conference Wednesday, June 12 in Minneapolis, MN. Dr. Lee’s presentation, Voiding Control and Reliability of Solder Joints with Backward Compatibility, will discuss the voiding performance of backward compatible systems in… Read Full Article

Posted on 22 May 2013

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Indium Corporation Technology Expert to Present at ECTC

Dr. Ning-Cheng Lee

Indium Corporation’s Dr. Ning-Cheng Lee, Vice President of Technology, will give several presentations at the 63^rd Electronic Components and Technology Conference (ECTC) May 28-31 in Las Vegas, NV. Professional Development Course: Lead-Free Solder Joint Reliability – Material Consideration. This course will cover materials considerations required for achieving high-reliability lead-free solder… Read Full Article

Posted on 9 May 2013

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Indium Corporation Technology Expert to Present at IMAPS Advanced Technology Workshop

Brook Sandy-Smith

Indium Corporation’s Brook Sandy-Smith, Product Support Specialist – PCB Assembly Materials, will present at the International Microelectronics and Packaging Society (IMAPS) Advanced Technology Workshop on Microelectronic Packaging for Medical and Hi-Reliability Devices May 13-14 in Minneapolis, MN. Sandy-Smith will present the following papers: A Low-Silver SAC Solder Alloy for High-Reliability… Read Full Article

Posted on 8 May 2013

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Indium Corporation Product Specialist to Present at Inaugural ESTC Conference

Brook Sandy-Smith

Indium Corporation’s Brook Sandy-Smith, Product Specialist – PCB Assembly Materials, will present at the inaugural Electronic System Technologies Conference May 20-23 in Las Vegas, Nev. Sandy-Smith will present Proven Strategies to Minimize Voiding under QFNs and other Bottom Termination Components. Her presentation will review proven approaches for eliminating QFN voiding,… Read Full Article

Posted on 7 May 2013

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Indium Corporation Product Specialist to Present at ICSR

Brook Sandy-Smith

Indium Corporation’s Brook Sandy-Smith, Product Support Specialist – PCB Assembly Materials, will present at the International Conference on Soldering and Reliability on Friday, May 17 in Toronto, Canada. Sandy-Smith’s presentation, Reliability Challenges for Bottom Termination Components, discusses electro-chemical reliability, assembly defects, and alloy reliability of bottom termination components, such as… Read Full Article

Posted on 7 May 2013

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Indium Corporation Features Heat-Spring® at PCIM

Indium Corporation will feature Heat-Spring^® thermal interface materials at PCIM Europe, May 14-16, in Nuremberg, Germany. Heat-Spring^®, a compressible thermal interface material (TIM), is a patented technology specifically designed for high-power thermal applications. This soft metal TIM is made with RoHS-compliant indium metal, which is six times softer than lead.… Read Full Article

Posted on 2 May 2013

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Indium Corporation Announces Void-Reducing Water-Soluble Solder Paste

Indium6.4 Water-Soluble Solder Paste’s flux chemistry minimizes voiding under QFN and BGA assemblies. A typical water-soluble solder paste has approximately 15-30 percent voiding; however, Indium6.4 consistently yields less than five percent. Indium6.4 provides: Fewer voids Smaller voids Good cleanability and reflow properties Exceptional response-to-pause printing Extended stencil life Exceptional slump… Read Full Article

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