Indium Corporation's Vice President of Technology, Dr. Ning-Cheng Lee, has published an article in the European electronics production publication EPP Europe. Dr. Lee's article, titled 'Combining superior anti-oxidation and superior printing: Is it really impossible?' appears in the December 2007 issue of the publication. The article details research done by Dr. Lee on a new solder paste offered by Indium Corporation. The product is designed to meet the need for improved product performance and reliability in progressively smaller sized electronics, such as iPods and cell phones. Solder paste is critical for reliable connections in most consumer electronics. Dr. Lee is a world-renown soldering expert and an SMTA Member of Distinction. He has extensive experience in the development of high-temperature polymers, encapsulants for microelectronics, underfills, and adhesives. His current research interests cover advanced materials for interconnects, and packaging for electronics and optoelectronics applications, with emphasis on both high performance and low cost of ownership. He is based at Indium's global headquarters in Clinton, NY, and resides in New Hartford, NY Indium Corporation is a premiere materials supplier to the global electronics assembly, semiconductor fabrication and packaging, solar photovoltaic, and thermal management markets. Founded in 1934, the company offers a broad range of products, services, and technical support focused on advanced materials science. With facilities in the PRC, Singapore, South Korea, the United Kingdom, and the USA, the company is a four-time Frost & Sullivan Award winner and registered to ISO-9001. For more information about Indium Corporation visit http://www.indium.com or email abrown@indium.com.