Indium Corporation's Dr. Ning-Cheng Lee, Vice President of Technology, and Dr. Hong-Sik Hwang, Research Chemist, received an honorable mention for their paper "A Compliant and Creep Resistant SAC-Al (Ni) Alloy" from the IPC at IPC Printed Circuits Expo, APEX and the Designers Summit, held April 13, 2008, in Las Vegas. The paper was also co-authored by Dr. Benlih Huang, Staff Engineer at FormFactor, Inc. The paper discusses Dr. Lee, Dr. Hwang, and Dr. Huang's research into a new alloy that addresses the common problems with the industry's standard alloy, SnAgCu (tin-silver-copper) or SAC. Also included are the results from their research on how to improve customers' finished goods reliability. Dr. Ning-Cheng Lee is a world-renown soldering expert and a Member of Distinction of the Surface Mount Technology Association (SMTA). He has extensive experience in the development of high-temperature polymers, encapsulants for microelectronics, underfills, and adhesives. His current research interests cover advanced materials for interconnects, and packaging for electronics and optoelectronics applications, with emphasis on both high performance and low cost of ownership. Dr. Hong-Sik Hwang, a Research Chemist, has been with Indium Corporation since 2002. Prior to joining Indium, Hong-Sik was with the National Center for Agricultural Utilization Research. He received his Ph.D. in Organic Chemistry from Texas Tech University in 1996. His current interests involve conductive adhesives and solar metallization pastes. Dr. Benlih Huang is currently a Staff Engineer for FormFactor Inc. While at Indium Corporation he was a Research Metallurgist whose work included solder alloy development and semiconductor packaging materials and processing exploration. Dr. Huang is a patent holder and an author, receiving two awards for his papers. He received his master's degree in Materials Science from Dartmouth College and his Ph.D. in Materials Science from Rutgers University. Indium Corporation is a premiere materials supplier to the global electronics assembly, semiconductor fabrication and packaging, solar photovoltaic, and thermal management markets. Founded in 1934, the company offers a broad range of products, services, and technical support focused on advanced materials science. With facilities in the PRC, Singapore, South Korea, the United Kingdom, and the USA, the company is a four-time Frost & Sullivan Award winner and registered to ISO-9001. For more information about Indium Corporation visit or email