Indium Corporation's Indium8.9 Pb-Free No-Clean Solder Paste was honored twice in two weeks with leading electronics assembly awards. Indium8.9 earned the VISION Award at the APEX convention in Las Vegas, NV, and just one week later, garnered the China VISION award at NEPCON China in Shanghai, China. Sponsored by SMT Magazine, and SMT China Magazine, the VISION Awards honor the products and technologies that have shaped the PCB manufacturing industry over the past year. Indium8.9 is a third-generation solder paste that delivers more performance than any Pb-free solder paste on the market, bringing together the reliability of a Sn/Pb paste with RoHS compliance. Indium8.9 exhibits outstanding print-transfer properties, especially with CSP, 0201, and 01005 components, with consistent print volumes through apertures below the industry recommended minimum area ratio of 0.66. A robust reflow process window can accommodate high peak temperatures and long soak profiles. Indium8.9 eliminates "head-in-pillow" defects when mounting BGA devices. Its excellent wetting improves first-pass yields and reduces field failures. In addition, Indium8.9 provides excellent test probeability and is thermally stable, offering soft, pliable post-reflow residues resulting in fewer false rejects during in-circuit testing. Indium8.9 also provides low-voiding properties: <5% voiding in a multitude of profiles when soldering BGAs with via-in-pad technology. Indium Corporation is a premiere materials supplier to the global electronics assembly, semiconductor fabrication and packaging, solar photovoltaic, and thermal management markets. Founded in 1934, the company offers a broad range of products, services, and technical support focused on advanced materials science. With facilities in the PRC, Singapore, South Korea, the United Kingdom, and the USA, the company is a four-time Frost & Sullivan Award winner and registered to ISO-9001. For more information about Indium8.9 visit www.indium.com/big or email abrown@indium.com.