Two of Indium Corporation's technology experts will be participating in the International Wafer-Level Packaging Conference (IWLPC), October 13-16, 2008 in San Jose, CA: Semiconductor Packaging Materials Product Manager, Andy C. Mackie, Ph.D. and Applications Engineer Jim Hisert.((Dr. Mackie will be chairing Session 10, which includes presentations by 4 industry experts in wafer-level packaging. Thursday, October 16, 1:00pm - 3:00pm((Jim Hisert will be presenting the paper Metrology in Wafer-Level Microsphere Processes. This leading-edge paper is a result of collaborative testing with DEK International and FRT of America. Wednesday, October 15, 3:30pm - 5:30pm

Dr. Mackie has a Ph.D. in Physical Chemistry from the University of Nottingham, UK, and a master of science degree in Surface and Colloid Chemistry from the University of Bristol, UK. He is an industry expert in solder paste printing, reflow, and atmosphere control in electronics assembly. Dr. Mackie is trained in Six Sigma "Design of Experiments" and has written numerous papers that have been published globally.((Jim Hisert has a bachelor's degree in Mechanical Engineering Technology from the State University of New York Institute of Technology and is a member of the American Society of Mechanical Engineers. Jim is a patent-holder for a fiber optic sensor, has presented at various industry organizations and technical seminars, and has authored technical papers on thermal management as well as semiconductor packaging assembly. Jim also authors a blog on semiconductor packaging assembly. Jim also authors a blog on semiconductor packaging at www.indium.com/blogs/Jim-Hisert-Blog.

IWLPC is sponsored jointly by the SMTA and Chip Scale Review magazine. It explores cutting edge topics in wafer-level packaging and IC/MEMS/MOEMS packaging, including 3D/Stacked/CSP/SiP/SoP and mixed technology packages.((Indium Corporation is a premiere materials supplier to the global electronics assembly, semiconductor fabrication and packaging, solar photovoltaic, and thermal management markets. Founded in 1934, the company offers a broad range of products, services, and technical support focused on advanced materials science. With facilities in the PRC, Singapore, South Korea, the United Kingdom, and the USA, the company is a five-time Frost & Sullivan Award winner and registered to ISO-9001.((For more information about IWLPC or to register for these conferences, visit www.iwlpc.com.

For more information about Indium Corporation visit www.indium.com or email abrown@indium.com.