Indium Corporation Product Support Specialist of PCB Assembly Materials Brook Sandy will share her expertise at the SMTA Ohio Valley Chapter Solder Paste Round Table meeting on May 18 in Hilliard, Ohio.

Brook will present Impact of Component Miniaturization, which discusses process and materials considerations to optimally assemble miniaturized components. Specific topics include head-in-pillow, graping, voiding, materials selection, and alloy development for increased drop shock reliability. 

Brook acts as a technical liaison between Indium Corporation customers and internal departments, such as R&D and production, to ensure the best quality and selection of products. Brook attended the University of Rhode Island in the International Engineering Program, and earned degrees in chemical engineering (with a focus on materials), and German language. She also authors a blog, which can be found at blogs.indium.com/blog/brooksandy.

For more information, visit www.smta.org.

 

Indium Corporation is a premier materials supplier to the global electronics, semiconductor, solar, thin-film and thermal management markets. Products include solders, preforms, and fluxes; brazes; sputter targets; indium, gallium, and germanium metals and compounds; and Reactive NanoFoil®. Founded in 1934, Indium Corporation has global technical support and factories located in China, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com.