Indium Corporation had three technical papers accepted for presentation at APEX in Las Vegas, Nevada, March 29 - April 5, 2009.

Tim Jensen, Solder Paste Product Manager, authored Challenges in Implementing a Halogen-Free Process, which focuses on the process development challenges in implementing a halogen-free assembly process, including solder paste evaluation and selection, solder fluxes, the SMT stencil printing process, reflow, and test.
- Thursday, April 2, 10:15am - 11:45am

A "Flash Abstract" video is available for this technical paper, however you must have both Javascript and Flash enabled in order to view it.

Mario Scalzo, Senior Technical Support Engineer, authored Addressing the Challenge of Head-in-Pillow Defects in Electronics Assembly, which discusses the two main sources of head-in-pillow defects and solutions for their elimination.
- Tuesday, March 31, 1:30pm - 3:00pm

A "Flash Abstract" video is available for this technical paper, however you must have both Javascript and Flash enabled in order to view it.

Chris Anglin, Technical Support Engineer, authored Establishing a Precision Stencil Printing Process. Chris's paper summarizes a significant amount of experimental data and process optimization techniques used to establish a precision SMT printing process.
- Wednesday, April 1, 1:30pm - 3:00pm

A "Flash Abstract" video is available for this technical paper, however you must have both Javascript and Flash enabled in order to view it.

Sponsored by IPC, this technical conference is known worldwide as one of the finest and most selective in the world.   

Tim Jensen has a bachelor's degree in Chemical Engineering from Clarkson University. He has authored technical publications and numerous process and technical guidelines. Tim is a member of the SMTA and participates actively in several IPC standards development committees.

Mario Scalzo joined Indium Corporation in 2000. He holds a bachelor's degree in Chemistry from Saint Anselm College. He also holds a certificate from the American Chemical Society for Professional Education. In addition, he is an SMTA-Certified Process Engineer and has a Six-Sigma Black Belt from Dartmouth College's Thayer School of Engineering. He is also the author of the Electronics Assembly Materials blog, http://www.indium.com/blogs/Mario-Scalzo-Blog/.

Chris Anglin has over 15 years of experience in advanced process development, new product introduction, and electronics assembly manufacturing.  He has a master's degree in Industrial Engineering from the State University of New York at Binghamton. He is trained in Six Sigma Black Belt programs and is also an SMTA-certified process engineer.

Indium Corporation is a premiere materials supplier to the global electronics assembly, semiconductor fabrication and packaging, solar photovoltaic, and thermal management markets.  Founded in 1934, the company offers a broad range of products, services, and technical support focused on advanced materials science.  With facilities in the PRC, Singapore, South Korea, the United Kingdom, and the USA, the company is a four-time Frost & Sullivan Award winner and registered to ISO-9001.

For more information about the technical conferences and APEX, visit http://www.goipcshows.org.

For more information about Indium Corporation, visit http://www.indium.com or email abrown@indium.com.