Indium Corporation announces Assistant Technical Manager Wisdom Qu, Assistant Technical Manager Eric Bastow, and Northeast Technical Support Engineer Amanda Hartnett as the company's Silver Quill Award winners for 2011.

Wisdom's paper, Reducing QFN and LGA Voiding with Solder Preforms, was one of two Papers of the Year and published at SMTA East China, May 2011. Eric was also recognized for Paper of the Year with Effects of Partially Activated No-Clean Flux Residues on Electrical Reliability, which was published at IPC APEX, April 2011.

Amanda Hartnett was awarded Best Written Paper for her work on A Room Temperature, Low Stress Bonding Process. This paper was published at SVC Tech Con, April 2011.

All three of these papers can be downloaded from Indium Corporation's website at www.indium.com/techlibrary/whitepapers.

Indium's Silver Quill Award was developed to encourage individuals to author technical reports, presentations, articles, and books and to honor the most effective works. Points are awarded for the quality and quantity of the work and its relevance and impact in the market.

Wisdom, a 2007 recipient of the Silver Quill Award for Best Paper/Presentation of the Year, has been with Indium Corporation since 2005. Wisdom provides technical support for Indium Corporation's electronics assembly materials, semiconductor and advanced assembly materials, and epoxy flux products. She earned a degree in mathematics from Hubei Radio and Television University in China. Wisdom is an SMTA-certified Process Engineer.

Eric has been with Indium Corporation for over ten years. He is an SMTA-certified process engineer (CSMTPE) and is certified as a Six Sigma Green Belt from Dartmouth College's Thayer School of Engineering. He is also a certified IPC-A-600 and 610D Specialist. Eric has an associate's degree in engineering science from Herkimer County Community College and has authored several technical papers and articles. Eric has experience in developing new solder paste flux chemistries, performing residual gas analysis of hermetic electronic packages, and developing electroless nickel-plating bath chemistries. He also authors a technology blog, which can be found at blogs.indium.com/blog/eric-bastow.

Amanda provides advice on thermal design issues in many different industries, including communications, military, and photonics. She specializes in coaching manufacturing, process, and design engineers on their choice and application of solder interface materials and other bonding materials to achieve reliable and high-performance thermal attachment solutions. She is active in several industry organizations including SPIE and IMAPS, as well as industry-leading DARPA projects. Amanda has a bachelor's degree in chemistry from Utica College and is completing her graduate degree at the State University of New York Institute of Technology. She also authors a technology blog, which can be found at blogs.indium.com/blog/amanda-hartnett.

Indium Corporation is a premier materials supplier to the global electronics, semiconductor, solar, thin-film, and thermal management markets. Products include solders, preforms, and fluxes; brazes; sputter targets; indium, gallium, germanium and tin compounds, and high purity metals; and Reactive NanoFoil®. Founded in 1934, Indium Corporation has global technical support and factories located in China, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com.