Thermal interface materials (TIMs) play a critical role in transporting heat away from the power die within high-reliability, high-power applications, increasing functionality and the life of the power module. Wilson’s presentation, Thermal Interface Materials in High-Reliability Applications, will include the results of a performance comparison between Heat-Springs® and thermal grease, PCMs, and graphite. Criteria reviewed in this study included bake test, power cycling, changes in interface resistance and solder thickness, and thermal cycling.
Wilson supports European-based customers with comprehensive technical advice on the selection, use, and application of solder paste, flux, and engineered solders. His expertise spans a number of industries, including electronics assembly, optoelectronics, thermal management, semiconductor packaging, and more.
HtM is organized by IMAPS-UK and the University of Oxford, and sponsored by Indium Corporation. This event brings together developers, manufacturers, end-users and supply chain companies to promote business opportunities in the advanced high-temperature electronics sector. For more event information, visit uk.imapseurope.org.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, solar, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.