Indium Corporation’s Dr. Ning-Cheng Lee, Vice President of Technology, will present at IPC’s Innovations in Electronics Manufacturing for Medical Devices conference Wednesday, June 12 in Minneapolis, MN.
Dr. Lee’s presentation, Voiding Control and Reliability of Solder Joints with Backward Compatibility, will discuss the voiding performance of backward compatible systems in terms of reflow profiles, and alloy combinations. Additionally, he will compare tin-lead systems to lead-free systems and the reliability of backward compatible systems.
Dr. Lee is a world-renown soldering expert and an SMTA Member of Distinction. He has extensive experience in the development of high-temperature polymers, encapsulants for microelectronics, underfills, and adhesives. His current research interests include advance materials for interconnects and packaging for electronics and optoelectronics applications, with an emphasis on both high performance and low cost of ownership.
IPC’s Innovations in Electronics Manufacturing for Medical Devices is focused exclusively on the innovations taking place in electronics manufacturing at every stage of the medical device’s supply chain. Topics include:
- Identifying new market forces driving cost reductions
- How companies are conquering global regulatory hurdles
- The newest lead-free technology breakthroughs facilitating reliability improvements
- Practical and advanced manufacturing techniques currently being utilized in the age of miniaturization.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, solar, thin-film, and thermal management markets. Products include solders, preforms, and fluxes; brazes; sputtering targets; indium, gallium, and germanium metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Singapore, South Korea, the United Kingdom, and the USA.