Indium Corporation technology experts shared their technical expertise at the International Microelectronics and Packaging Symposium 2012 (IMAPS) in San Diego, CA, held September 11 – 13, 2012.

Ning-Cheng Lee, PhD, Vice President of Technology presented two tech papers:

  • High Reliability High Melting Lead-Free Mixed BiAgX Solder Paste System received the IMAPS 2012 Best in Session Award, and was co-authored by Research Metallurgist Hongwen Zhang. This paper explains the research involved in identifying lead-free alternatives for high melting, high lead solder alloys. Also discussed are a novel high melting lead-free BiAgX® mixed solder paste system, and a comparison of its performance to several representative high lead solder alloys. This paper is available for download from this link to our technical library.
  • Superior Drop Test Performance of BGA Assembly Using SAC105Ti Solder Sphere explores the board-level drop test performance of four different solder combinations in BGA/CSP assembly. The data derived from this research helps to understand the failure mechanism and performance of various Pb-free alloys. This paper is available for download from this link to our technical library.

Dr. Lee also taught the professional development course Package on Package Technology- What is it, What Works, What Doesn't Work.

Ronald C. Lasky, PhD, PE, Senior Technologist, and Seth Homer, Product Support Specialist, co-chaired the:

  • Pb-Free Solder and RoHS session. This session focused on the process and reliability improvement in light of the ongoing push towards Pb-free and RoHS compliance.

Dr. Lee is a world-renown soldering expert and an SMTA Member of Distinction. He has extensive experience in the development of solder pastes, fluxes, high-temperature polymers, encapsulants for microelectronics, underfills, and adhesives. Hiscurrent research interests cover advanced materials for interconnects and packaging for electronics and optoelectronics applications, with emphasis on both high-performance and low-cost of ownership. Dr. Lee is also a member of the SMTAI planning committee.

Dr. Lasky, holder of the prestigious SMTA Founder's Award, is a world-renown process expert and an Instructional Professor at Dartmouth College. He has over 25 years of experience in electronics and optoelectronic packaging and assembly. He has authored or edited five books and numerous technical papers and holds several patent disclosures. Dr. Lasky also authors a technology blog which can be found at

Seth Homer is the product support specialist for Engineered Solder Materials. He has been with Indium Corporation for over 15 years, serving as manufacturing supervisor for various engineered electronics assembly materials, including: solder spheres, sputtering targets, indium chemicals, and solderpreforms. Seth has worked extensively with Indium's customer support teams, especially those in China, Singapore, and Europe.

IMAPS is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging. IMAPS produces numerous publications, workshops, international conferences, professional development courses, and exhibitions that bring together the entire microelectronics supply chain. Events and products focus on those technologies critical to the present and future of microelectronics: 3D integration, MEMS, flip chip, wafer level packaging, thermal management, printed electronics, advanced materials, photonics, modeling/design, as well as many others.

Indium Corporation is a premier materials supplier to the global electronics, semiconductor, solar, thin-film and thermal management markets. Products include solders, preforms, and fluxes; brazes; sputter targets; indium, gallium, and germanium chemicals and sourcing; and Reactive NanoFoil®. Founded in 1934, Indium Corporation has global technical support and factories located in China, Singapore, South Korea, the United Kingdom, and the USA.

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