Indium Corporation's Global Product Manager, Andy C. Mackie, Ph. D., MSc, is presenting at the Northeast Dispensing and Coatings Workshop, presented by Nordson ASYMTEK and Assembly Products, October 19-20 in Westford, MA USA.

Dr. Mackie is presenting Fluid Materials — "Materials Deposition Techniques for Advanced Electronics and Semiconductor Assembly Materials in the '10's" as part of the workshop on dispensing and jet technology. This paper discusses the comparative advantages and disadvantages of flux and solder paste deposition methods for electronics assembly and semiconductor packaging technologies, and the associated metrology methods.

Dr. Mackie has over 20 years of experience in new product and process development and materials marketing in all areas of electronics manufacturing, including wafer fabrication, electronics assembly, and semiconductor packaging. He is an electronics industry expert in physical chemistry, surface chemistry, rheology, solder materials properties and processes (including solder paste printing), and reflow processes.

Dr. Mackie received the prestigious IPC President's Award in 2001 for his leadership in both the Solder Paste Task Group and the Assembly and Joining Materials sub-committee. He is formally trained in Six Sigma "Design of Experiments" and has written papers and lectured internationally on subjects ranging from sub-ppb metals analysis in supercritical carbon dioxide to pin-probe testing of flux residues. Additionally, Dr. Mackie holds patents in novel polymers, gas analysis, and solder paste formulation.

Dr. Mackie has a PhD in Physical Chemistry from the University of Nottingham, UK, and a Masters of Science (MSc) in Surface and Colloid Chemistry from the University of Bristol, UK. Dr. Mackie is based at Indium's global headquarters in Clinton, NY, USA. He is also the author of the Semiconductor / Power Semiconductor Assembly blog

For more information or to register for the conference, visit the Nordson ASYMTEK events page.

Indium Corporation is a premier materials supplier to the global electronics, semiconductor, solar, thin film and thermal management markets. Products include solders, preforms, and fluxes; brazes; sputter targets; indium, gallium, and germanium chemicals and sourcing; and Reactive NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation visit www.indium.com or email abrown@indium.com