Indium Corporation was presented with the Global Technology Award for its BiAgX® solder paste at SMTA International in Rosemont, Ill. on Tuesday, September 30.
Sponsored by Global SMT & Packaging the Global Technology Awards have acknowledged outstanding innovations in the printed circuit board assembly and packaging industry for the past 10 years.
BiAgX® was created specifically for high-temperature die-attach applications in discrete power devices. Designed as a drop-in replacement for standard high Pb-containing solder pastes, it has passed MSL1, HAST, and thermal cycle testing at several power semiconductor customers.
BiAgX® is suited for small, low-voltage QFN packages that are used in portable electronics, such as smartphones and tablets, automotive assemblies, and industrial applications. BiAgX®excels in high junction-temperature environments in excess of 150°C. It requires minimal process adjustments and no extra capital expenditure for customers converting from a standard high Pb-containing solder paste-based die-attach process.
BiAgX® addresses both customer demands and legislative changes that eliminate lead from high-melting die-attach applications. It is both Pb-free and Sb-free and does not contain costly specialty materials, such as nanosilver or sintering aids.
BiAgX® reflows, solders, wets, and solidifies just like any other solder paste, and is available in both dispensing and printing forms. Fluxes are cleanable with standard cleaning chemistries and processes.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, solar, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.