Wilson’s presentation, Elimination of Head-in-Pillow in PoP Assembly: A Flux Approach, discusses eliminating head-in-pillow defects in the package-on-package (PoP) assembly process by engineering unique attributes of the flux chemistries of dipping fluxes and pastes.
For more information, visit afeit.asso.fr/brasage-2014.
Wilson is responsible for providing comprehensive technical advice in the selection, use, and application of solder pastes, fluxes, and engineered solders to customers in the electronics assembly, optoelectronics, thermal management, semiconductor packaging, and related industries. He is based in the United Kingdom and has over 20 years of experience in electronics assembly, including Pb-free process implementation, production engineering, RoHS compliance, and component finishes. Wilson has a degree in HNC Electronics from Nene University in Northampton, England, and is certified as a Six Sigma Green Belt through Dartmouth College’s Thayer School of Engineering
Organized for more than 15 years, Brasage is now a reoccurring event for the electronics industry, recognized and respected by the profession. This year, printed circuits, brazing, PCB assembly, reliability, and the future of the electronics industry will be the main topics.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, solar, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Singapore, South Korea, the United Kingdom, and the USA.