Indium Corporation's Eric Bastow, assistant technical manager, will present at the International Microelectronics and Packaging Society (IMAPS) Metro Chapter in Ronkonkoma, NY, on Wednesday, September 26.
Bastow's presentation, A Comparison of Eutectic AuSn Alloy Delivery Options and Assembly Processes for LED Die-attachment, focuses on gold-tin alloys and their ability to meet the stringent requirements of current environmental legislation, as well as the challenges of assembling modern electronics devices.
High-power semiconductor devices, such as high-brightness LEDs, must be mounted using a die-attach material that can handle the temperature fluctuations generated by the chip, and the mechanical stresses due to CTE mismatches between the die material and the substrate upon which it is mounted. The die-attach material must also comply with current legislation, which restricts manufactured products from containing numerous materials due to environmental concerns. Gold-tin survives these stresses, possesses favorable materials properties, and can be processed without a flux.
Bastow provides technical support for Indium Corporation's full range of solder products for the electronics assembly, semiconductor packaging, and thermal management markets. He is a certified process engineer and has earned his Six Sigma Green Belt from the Thayer School of Engineering at Dartmouth College. He is also a certified IPC-A-600 and 610D specialist. IMAPS is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education. The Society's portfolio of technologies is disseminated through symposia, conferences, workshops, and professional development courses. IMAPS currently has more than 8,000 national and international members. For more information or to register for the event, call Steve Lehnert at 605-644-5218 or email firstname.lastname@example.org. Indium Corporation is a premier materials supplier to the global electronics, semiconductor, solar, thin-film and thermal management markets. Products include solders, preforms, and fluxes; brazes; sputter targets; indium, gallium, and germanium metals and compounds; and Reactive NanoFoil®. Founded in 1934, Indium Corporation has global technical support and factories located in China, Singapore, South Korea, the United Kingdom, and the USA.