Indium Corporation’s Pony Liao, Area Technical Manager for Northern China, will share his technical expertise at the CEIA Shanghai Seminar on July 19 in Shanghai, China.

Pony’s presentation, How to Achieve High Reliability in Automotive Electronics, will focus on how to address the unique challenges encountered by automotive electronics assemblers. Topics will include materials for achieving high-performance on first yields, electrochemical reliability, voiding, and coating. He will also share the test results of a new high-reliability alloy.

Indium Corporation will also be exhibiting at the seminar. Their booth will feature low-voiding soldering materials for the automotive market, including Indium8.9HF Solder Paste and Indium10.1HF Solder Paste. Technical experts will be available at the booth to answer questions about the presentation and help resolve customers’ assembly challenges.

Liao provides technical support for Indium Corporation’s electronics assembly materials, semiconductor and advanced assembly materials, and engineered solders and thermal management materials. He has more than 10 years of experience in surface mount technology, specializing in defect prevention, quality continuous improvement, and cost reduction. Liao earned his bachelor’s degree from Tianjin University in mechanical and electronics engineering.

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com. You can also follow our experts From One Engineer To Another® (#FOETA) at www.facebook.com/indium or @IndiumCorp.