Indium Corporation’s, Dr. HongWen Zhang, Manager, R&D Alloy Group, will present at China Semiconductor Packaging Test Seminar (CSPT) 2018 from Nov. 19-21 in Hefei, Anhui, China.

It is well known that lead-containing materials can have harmful effects on human health and the environment. Furthermore, emerging high power semiconductor devices and modules serving high current and high junction temperatures of 150°C or higher require more reliable materials with high thermal conductivity. Considering these two challenges, Indium Corporation has started the exploration into high-temperature lead-free materials to help promote and support the industry’s progress toward lead-free.

Dr. Zhang’s presentation, Lead-Free Bonding Materials for Power Semiconductor Die-Attachment, examines die-attach material alternatives for these emerging, high-power semiconductor devices. Balancing materials’ reliability and cost, Zhang outlines potential alternatives, including solder and diffusion bonding materials.

Dr. Zhang joined Indium Corporation in 2008 as a Research Metallurgist responsible for the development of new high-temperature lead-free solders. He and Dr. Ning-Cheng Lee invented the mixed powder solder technique, which was the basis for developing the BiAgX® solder system. He has published more than 20 papers and journal articles. He received his PhD in material science and engineering, as well as a master’s degree in mechanical engineering from Michigan Technological University. Dr. Zhang holds a Lean Six Sigma Green Belt and is IPC-A-600 and IPC-A-610D trained.

During the show, Indium Corporation will feature those products referenced during Dr. Zhang’s presentation, BiAgX® and NC-SMQ®75, at its booth, as well as other advanced materials for semiconductor packaging.

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.