Wilson will present High-Power Device Assembly: A Reinforced Matrix Solder Preform Solution for Bondline Control & Increased Reliability. This presentation explores how a solder preform with a reinforced matrix can maintain bondline coplanarity, improve reliability, and reduce the overall cost of ownership for a substrate as compared to current techniques, such as stamped bumps or stitched wire bonds on the substrate.
Wilson is a Senior Applications Engineer for Indium Corporation’s European operations. He supports customers with comprehensive technical advice on the selection, use, and application of solder pastes, fluxes, and engineered solders. He has more than 20 years of experience spanning a number of industries, including a focus on electronics assembly and thermal management. He is certified as a Six Sigma Green Belt through the Thayer School of Engineering at Dartmouth and shares his expertise at conferences internationally. Wilson earned his degree in HNC Electronics from the University of Northampton.
TEC Lund features discussions and exhibits on advanced and emerging technologies in printed circuit board design, the current component situation, as well as the latest innovations within electronics assembly technologies. Indium Corporation will also be exhibiting at this event.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit www.indium.com or email email@example.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.