Two Indium Corporation experts were honored with a Best Paper Award at the International Microsystems, Packaging, Assembly, and Circuits Conference (IMPACT) 2018, October 24-26, in Taipei, Taiwan.
Dr. Ning-Cheng Lee, Vice President of Technology, presented Nano-Cu Sintering Paste for High Power Devices Die-Attach Applications at IMPACT 2017. The paper, co-authored by Research Scientist Dr. Min Yao, examined how a nano-Cu pressureless sintering paste, developed specifically for joint formation applications, performed when subjected to a variety of tests for oxidation resistance.
The Best Paper selection process involved a three-stage review process, which included abstract, full paper, and onsite oral presentation. More than 180 papers were reviewed and judged for this award.
Dr. Lee is a world-renowned soldering expert, an SMTA Member of Distinction, and IEEE Fellow. He has extensive experience in the development of fluxes, alloys, and solder pastes for SMT, and extensive experience in the development of high-temperature polymers, encapsulants for microelectronics, underfills, and adhesives. In addition to SMT and semiconductor soldering materials, his research also extends to nanobonding technology and thermal conductive materials.
Dr. Yao joined Indium Corporation in 2015. She has experience in the research and development of products for the electronics industry. Dr. Yao received a bachelor’s degree in chemistry from Anqin Normal University, and a doctorate in chemistry from Huazhong Normal University.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
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