Indium Corporation will feature its reinforced solder alloy fabrications, InFORMS®, at APEC 2018, March 4-8, in San Antonio, Texas.

Indium Corporation is redefining solder with its InFORMS preforms and patent-pending solder ribbon for automated assembly.

According to Seth Homer, Product Manager, InFORMS are a composite fabrication consisting of solder and a reinforcing matrix that stabilizes bondline thickness. “Using an InFORM between the baseplate and substrate will ensure bondline planarity, giving your assembly a much more stable joint and increasing the reliability of your end product.”

InFORMS are invaluable in the production process because they provide:

  • A drop-in replacement for other bondline control methods
  • Increased lateral strength
  • Bondline co-planarity
  • Improved thermal cycling reliability

InFORMS are available in a variety of alloys, including SAC and SnPb alloys.

For more information about InFORMS, visit www.indium.com/inform.

For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.