Indium Corporation’s Dr. Ron Lasky, Senior Technologist, and Sze Pei Lim, Semiconductor Product Manager for Asia, will present at Pan Pacific Microelectronics Symposium 2018 (Pan Pac) in Hawaii, Feb. 5-8, 2018.

Dr. Lasky’s presentation, Using Cpk and Cpk Confidence Intervals to Evaluate Stencil Printing, will discuss a new technique to calculate 95% confidence intervals on Cpk, including an Excel® spreadsheet developed to calculate Cpk and its confidence intervals. He will also detail the difference between data being statistically significant and practically significant. In addition to his presentation, Dr. Lasky will serve as chairperson for a session on Advanced Materials.

Lim’s presentation, Challenges in Material Selection for SiP Applications, will discuss recommended guidelines for selecting appropriate solder pastes and flip-chip fluxes based on System-in-Package (SiP) design and requirements within the packaging industry. Her presentation will also present testing results.

Dr. Lasky, holder of the prestigious SMTA Founder’s Award, is a world-renowned process expert and Senior Technologist at Indium Corporation. He is also a Professor of Engineering and the Director of the Cook Engineering Design Center at Dartmouth College. He has more than 30 years of experience in electronics and optoelectronic packaging and assembly. Dr. Lasky has authored six books, and contributed to nine more on science, electronics, and optoelectronics. Additionally, he has served as an adjunct professor at several colleges, teaching more than 20 different courses on topics ranging from electronics packaging, materials science, physics, mechanical engineering and science, and religion. Dr. Lasky holds numerous patent disclosures and is the developer of several SMT processing software products relating to cost estimating, line balancing, and process optimization. He is the co-creator of engineering certification exams that set standards in the electronics assembly industry, worldwide.

Lim has more than 20 years of experience in the PCB assembly and semiconductor packaging industries and is highly respected in her field. She earned her bachelor’s degree in chemistry from the National University of Singapore, is an SMTA-certified process engineer, and has a Six Sigma Green Belt. Lim joined Indium Corporation in 2007.

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com. You can also follow our experts From One Engineer To Another® (#FOETA) at www.facebook.com/indium or @IndiumCorp.