Indium Corporation will partner with 3S Silicon Tech, Inc. to host a technology seminar on solder joint reliability for automotive electronics on Aug. 11 in Taiwan Hsinchu.

Technical experts from both companies will detail high-reliability technology and materials for automotive electronics applications, including:

  • High-reliability alloys and low-temperature solders
  • Reliable materials for SiP applications
  • Power semiconductor developments and applications in the automotive market
  • Vacuum oven reflow technology and applications

For registration details, contact Tommy at tfan@indium.com.

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.

3S is a total solutions provider of die bonding in discrete power devices. 3S was established in 1998, headquartered in Hsinchu, with branch offices and sales offices in Shanghai, Singapore, Philippines and Malaysia.