Indium Corporation’s Silver Quill Award program encourages individuals to author world-class technical reports, presentations, articles, and books. It then honors the most effective works based on their relevance to, and impact on, the industry.
Sandy-Smith’s technical article, Overcoming Assembly Challenges with BTCs, Technical Support Engineer for PCB Assembly Materials, details the updated recommendations for design and implementation of bottom-termination components (BTCs), including major changes made to industry standard IPC-7093. This paper was first presented at the Electronic Design Innovation Conference and Exhibition 2017, was recognized as an Outstanding Paper Award Finalist, and published in Microwave Journal.
Brook Sandy-Smith is a Technical Support Engineer based at Indium Corporation’s Global Headquarters in Clinton, NY and a leader in the industry for technical knowledge and support. Specializing in PCB assembly materials, she works closely with customers to develop custom solutions to optimize their processes. Sandy-Smith is an SMTA Certified Process Engineer and has a passion for developing and implementing standardized test methods. She is an active member of several IPC committees, SMTA programs, and iNEMI projects, and is currently serving as chair of the J-004 committee and Vice President of technical programs for the SMTA Empire chapter. Sandy-Smith graduated from the International Engineering Program at the University of Rhode Island with a degree in Chemical Engineering and German language.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
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