Indium Corporation's Derrick Herron, technical support engineer, will present at the American Society of Mechanical Engineers (ASME) meeting on Oct. 28 at 6 p.m. at the Spaghetti Kettle in Clinton, N.Y.

Herron will discuss Indium Corporation's NanoFoil®, which is a unique product comprised of alternating nanoscale layers of aluminum and nickel. NanoFoil®'s distinct characteristics allow instantaneous material bonding at room temperature, even in the absence of air, making this a product with numerous applications in the electronics and assembly industries. 

Herron provides technical service to customers in the northeastern United States. Previously, he spent more than six years working in Indium Corporation's research and development laboratory, focusing on developments in solder paste and flux technologies. Herron earned his bachelor's degree in chemistry from Oklahoma State University, Stillwater, Okla. He earned his Six Sigma Green Belt from the Thayer School of Engineering at Dartmouth College and is certified in IPC-A-600 and IPC-A-610-D. 

ASME is a not-for-profit organization that enables collaboration, knowledge sharing, career enrichment, and skills development across all engineering disciplines with a goal of helping the global engineering community develop solutions to benefit lives and livelihoods. Founded in 1880, ASME has more than 140,000 members in 151 countries.

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, solar, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com.