Liao’s presentation, QFN Voiding Investigations and Solutions, will explore various methods to reduce voiding in bottom termination components, including:
- 0402 or 0201 Solder Fortification® preforms
- Flux-coated preforms
- Optimized flux formulation
Liao provides technical support for Indium Corporation’s electronics assembly materials, semiconductor and advanced assembly materials, and engineered solders and thermal management materials. He has more than ten years of experience in surface mount technology, specializing in defect prevention, quality continuous improvement, and cost reduction. Liao earned a bachelor’s degree from Tianjin University in Mechanical and Electronics Engineering.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit www.indium.com or email firstname.lastname@example.org. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.