Indium Corporation’s Karthik Vijay, Technical Manager for Europe, Africa, and the Middle East, will present at European Power Electronics and Drives’s (EPE) 17th Conference on Power Electronics and Applications, Sept. 8-10 in Geneva, Switzerland.

Vijay’s presentation, Sn+ Heat-Spring® Solder TIMs for Superior Thermal Management, explores how Heat-Spring thermal interface materials (TIMs) perform against phase change materials and thermal greases under a variety of conditions. Vijay will also present comparative results as they relate to power cycling and bake testing, and discuss the advantages of Heat-Spring.

Vijay is based in the U.K. and manages Indium Corporation’s technology programs and technical support throughout Europe. His expertise is focused on solder paste, engineered solders, thermal interface materials, and semiconductor-grade electronics assembly materials. Vijay is active in several industry organizations, including IMAPS and SMTA, and he has presented at industry forums and conferences internationally. He earned his master’s degree in systems science and industrial engineering from the State University of New York, Binghamton.

EPE Conference on Power Electronics and Applications is an international exchange on the leading developments in these fields among scientists and industrial experts from around the world.

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, solar, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.