Indium Corporation's Karthik Vijay, technical manager for Europe, Africa, and the Middle East, will present at the International Microelectronics Assembly and Packaging Society (IMAPS) RaMP RF and Microwave Packaging Conference April 15-16 in Leeds, UK.
Karthik's presentation, Void Reduction & Better Thermal Management with Engineered Flux-Coated Solder Preforms, discusses the important attributes of flux-coating formulations and coating quality. Attributes include using a uniform flux-coating to reduce oxidation and minimize voids, using low-outgassing and low-voiding halogen-free flux coatings with a unique oxidation barrier to reduce oxidation and achieve equal/better wetting, and engineering the flux-coating rheology to facilitate tape & reel packaging for high-volume automation.
Karthik is based in the UK and manages Indium Corporation's technology programs and technical support throughout Europe. His expertise is focused on solder paste, engineered solders, thermal interface materials, and semiconductor-grade electronics assembly materials. Karthik is active in several industry organizations, including IMAPS and the Surface Mount Technology Association (SMTA), and has presented at industry forums and conferences internationally. He earned his master's degree in systems science and industrial engineering from Binghamton University, State University of New York.
IMAPS is a global community of microelectronic related engineers, scientists, manufacturers, end-users, and supply chain companies. The Society aims to support the development and growth of the microelectronics and related industries, and to aid the transfer of knowledge and information.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, solar, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
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