One of the biggest challenges facing the electronics industry today is voiding in the solder joints that connect bottom-terminated electronic components to PCBs. Liao's presentation, Voiding Control Beneath Bottom-Terminated Components Using Solder Fortification® Preforms, looks at a novel technique that uses Solder Fortification® Preforms for an easy and inexpensive process modification that both decreases the level of voiding and also decreases the amount of variation in this value.
Liao provides technical support for Indium Corporation's electronics assembly materials, semiconductor and advanced assembly materials, engineered solders, and thermal management materials. He has over 10 years of experience in surface mount technology, specializing in defect prevention, continuous quality improvement, and cost reduction. Liao has a bachelor's degree from Tianjin University in mechanical and electronics engineering.
IPC is a global trade association dedicated to furthering the competitive excellence and financial success of its electronics industry members. For more information about upcoming presentations, visit www.ipc.org.cn/Events/Technology-Seminar/2015/default.htm.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, solar, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit www.indium.com or email email@example.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.