Indium Corporation’s Andy Wei, PCBA Product Manager for China, will share his technical expertise at the IPC WorksAsia Technical Conference (Shenzhen) on June 23 in Shenzhen, China. The conference focuses on automotive electronics reliability.

Wei’s presentation, High-Reliability Alloy Solder Paste for Automotive Applications, will include:

  • An overview of the automotive electronics market
  • Key performance requirements for automotive electronics
  • Details on how to achieve high-reliability in automotive applications

Wei provides technical support for Indium Corporation’s electronics assembly materials for customers in China. He has more than 14 years of experience in electronics assembly, providing field support for soldering materials and SMT process applications. Wei earned his degree in electric engineering and automation from Zhengzhou Industrial Academy. He is an SMTA-Certified Process Engineer and is a Six Sigma Green Belt.

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.