Indium Corporation’s Karthik Vijay, Technical Manager for Europe, Africa, and the Middle East, will present at the RF and Microwave Packaging (RaMP) 2017 Workshop on April 26-27, in Paris, France.

Karthik will present Enhanced Thermal Management with Compressible Solder Thermal Interface Materials (TIMs) and Engineered Low-Voiding Solder Preforms. This presentation provides insight into how compressible solder TIMs and engineered solder preforms can be used to achieve enhanced thermal management and reliability.

Karthik is based in the UK and manages Indium Corporation’s technology programs and technical support throughout Europe. His expertise is focused on solder paste, engineered solders, thermal interface materials, and semiconductor-grade electronics assembly materials. Karthik is active in several industry organizations, including IMAPS and the Surface Mount Technology Association (SMTA), and has presented at industry forums and conferences internationally. He earned his master’s degree in systems science and industrial engineering from Binghamton University, State University of New York.

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.