Bahou will present Minimizing Voiding in Bottom Terminating Components, which provides an introduction to QFN challenges, determining void criteria, design of experiments (DOE), results, void control using Solder Fortification®, and conclusions.
Bahou supports Indium Corporation’s advanced SMT materials, fluxes and engineered thermal materials to customers on the west coast of the USA. He provides comprehensive technical advice in the selection, use and application of solder paste, fluxes, and solder alloy fabrications to customers in the electronics assembly industry. Bahou is based in Huntington Beach, Calif., and has more than 16 years of experience in electronics assembly manufacturing, including hands-on experience in SMT production. Bahou has a bachelor's degree in mechanical engineering from the University of Massachusetts Lowell. In addition, he has worked on the development of 01005 chip component placement onto a printed circuit board.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit www.indium.com or email firstname.lastname@example.org. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.