Indium Corporation’s Andreas Karch, Regional Technical Manager for Germany, Austria and Switzerland, will deliver a technical presentation at the IMAPS Autumn Conference on Oct. 20-21 in Munich, Germany.

The presentation, New Solder Material Technology in the Manufacturing Process of IGBT Modules, will discuss a new method that produces strong, reliable solder joints that resist cracking and thermal fatigue.

Karch provides support for Indium Corporation’s customers in Germany, Austria, and Switzerland. He shares process knowledge and makes technical recommendations for the use of Indium Corporation’s materials, including solder paste, solder preforms, fluxes, and thermal management materials. Karch has more than 20 years of automotive industry experience, including the advanced development of customized electronics. He is an ECQA-certified integrated design engineer and has a Six Sigma Yellow Belt. He was recently the recipient of the top 10 innovative patents for an automotive LED assembly. Karch maintains a thorough understanding of process technologies and project management skills.

IMAPS is a global community of microelectronic related engineers, scientists, manufacturers, end-users, and supply chain companies. The Society aims to support the development and growth of the microelectronics and related industries, and to aid the transfer of knowledge and information.

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, thermal management, and solar markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

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