Dr. Lee delivered a presentation, Challenges and Solutions for the Assembly of Thin-Profile Devices, at a seminar hosted by Indium Corporation and ZESTRON in Chengdu. His presentation included a discussion regarding the challenges for materials, processes, reliability, and cost of thin-profile devices, as well as Indium Corporation’s development of a new flux and soldering alloy that address these critical challenges.
Liang presented Engineered Solders Instructions and Application Case Study at the IPC Tour event in Shenzhen. Topics covered included engineered solder attributes, performance, processes, and examples.
Dr. Lee is a world-renowned soldering expert and an SMTA Member of Distinction. He has extensive experience in the development of high-temperature polymers, encapsulants for microelectronics, underfills, and adhesives. His current research interests include advanced materials for interconnects, and packaging for electronics and optoelectronics applications, with an emphasis on both high-performance and low cost of ownership.
Liang is based in Shenzhen, China, and provides technical support for Indium Corporation’s electronics assembly materials, semiconductor, engineering solders, and thermal management materials for customers in southern China. Liang has more than ten years of experience in electronics assembly, including providing field support for soldering materials applications.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, thermal management, and solar markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
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