Indium Corporation's Karthik Vijay, Technical Manager for Europe, Africa, and the Middle East, and Graham Wilson, Applications Engineer, will give poster presentations at PCIM Europe May 19-21 in Nuremberg, Germany.

Vijay's poster presentation, InFORMS® vs the Trimmed Wirebond Technique to Achieve Uniform Bondline Control between Substrate and Baseplate, will explore how post-solder bondline uniformity is influenced by operational temperature regimes, warpage of the substrates, and CTE mismatch. The non-uniformity of the bondline causes delamination and cracks in the solder that accelerate failure of the solder joint. Additionally, Vijay will compare the benefits of InFORMS® as a drop-in replacement for solder preforms without any additional process steps. 

Wilson's poster presentation, Sn+ Heat-Spring® Solder TIMs for Superior Thermal Management, explores how Heat-Spring thermal interface materials (TIMs) perform against phase change materials and thermal greases under a variety of conditions. Wilson will also present comparative results as they relate to power cycling and bake testing, and discuss the advantages of the Heat-Spring.

Vijay is based in the U.K. and manages Indium Corporation's technology programs and technical support throughout Europe. His expertise is focused on solder paste, engineered solders, thermal interface materials, and semiconductor-grade electronics assembly materials. Vijay is active in several industry organizations, including IMAPS and SMTA, and has presented at industry forums and conferences internationally. He earned his master's degree in systems science and industrial engineering from the State University of New York, Binghamton.

Wilson is an Applications Engineer for Indium Corporation's European operations. He supports customers with comprehensive technical advice on the selection, use, and application of solder pastes, fluxes, and engineered solders. He has more than 20 years of experience spanning a number of industries, including a focus on electronics assembly and thermal management.  He is certified as a Six Sigma Green Belt through the Thayer School of Engineering at Dartmouth and shares his expertise at conferences internationally. Wilson earned his degree in HNC Electronics from the University of Northampton.

PCIM Europe focuses on future issues in the electronics industry, such as renewable energy, electro mobility, and energy management. More details about the technical programs can be found in the conference program.

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, solar, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.