Indium Corporation will feature its reinforced indium and solder alloy fabrications, InFORMS®, at PCIM Europe, May 10-12 in Nuremberg, Germany.

InFORMS are reinforced solder preforms that maintain a constant bondline thickness, thus significantly improving thermal cycling reliability. This is a key requirement in IGBT assembly of the DBC to the baseplate.

Key benefits of soldering InFORMS between DBC and baseplate include:

  • 4X improved thermal cycling reliability compared to a preform-only approach
  • 2X improved thermal cycling reliability compared to a preform + Al wirebond stitch approach
  • Low-voiding of <1%
  • Lowest cost of ownership – a drop-in replacement for a preform with no additional process steps or equipment needed

InFORMS provide engineers with an enhanced material for the development of new, or the improvement of existing, applications. For more information about InFORMS, visit www.indium.com/inform or visit Indium Corporation at stand 7-413.

For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.