InFORMS are reinforced solder preforms that maintain a constant bondline thickness, thus significantly improving thermal cycling reliability. This is a key requirement in IGBT assembly of the DBC to the baseplate.
Key benefits of soldering InFORMS between DBC and baseplate include:
- 4X improved thermal cycling reliability compared to a preform-only approach
- 2X improved thermal cycling reliability compared to a preform + Al wirebond stitch approach
- Low-voiding of <1%
- Lowest cost of ownership – a drop-in replacement for a preform with no additional process steps or equipment needed
InFORMS provide engineers with an enhanced material for the development of new, or the improvement of existing, applications. For more information about InFORMS, visit www.indium.com/inform or visit Indium Corporation at stand 7-413.
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