Indium Corporation will feature its reinforced indium and solder alloy fabrications InFORMS® at NEPCON Japan, Jan. 13-15 in Tokyo, Japan.

InFORMS® are high-reliability solder preforms that provide a consistent bondline thickness to maximize thermal and mechanical reliability. They also allow for exceptionally low voiding in solder joints, making them well-suited for IGBT assembly of the DBC to the baseplate.

InFORMS® maintain the highest thermal and electrical conductivity, as compared to typical soldered interconnections.  By controlling the bondline thickness, the thermal performance is also more repeatable from device to device. 

InFORMS provide engineers with an enhanced material for the development of new applications, or the improvement of existing ones. For more information about InFORMS®, visit www.indium.com/thermal-interface-materials, email askus@indium.com or visit Indium Corporation at NEPCON booth #13.

For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.