Depending on the alloy, gold-based solders have a melting point ranging from 280°C to 1064°C, making it compatible with subsequent reflow processes. In addition, gold-based solders are resistant to corrosion, provide superior thermal fatigue resistance, and exhibit excellent joint strength.
Indium Corporation’s AuSn preforms have the highest tensile strength of any solder, ensuring high-reliability for joining and sealing. AuSn preforms are designed for high-reliability applications, such as aerospace, defense, and medical.
Semiconductor-grade preforms are designed to meet the challenges faced as RF and power semiconductor devices continue to get smaller, with power density increasing both as a consequence of the shrink and as a result of increased power ratings.
Indium Corporation’s Pb-free and RoHS-compliant preforms are available in a variety of standard and custom-engineered designs. For more information about Indium Corporation’s gold alloy solder preforms, visit booth 121.
For more information about Indium Corporation, visit www.indium.com or email firstname.lastname@example.org. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.