Indium Corporation will feature its Indium3.2HF Solder Paste at SEMICON Taiwan 2017 in Taipei, Taiwan.

Indium Corporation’s Indium3.2HF is an air or nitrogen reflow, water-soluble solder paste specifically formulated for fine feature printing applications (Type 6SG).

Indium3.2HF is formulated to offer consistent, repeatable printing performance combined with a long stencil life. In addition, Indium3.2HF delivers:

  • Good response-to-pause
  • Wide reflow profile window
  • Outstanding slump resistance
  • Excellent wetting capability
  • Superior fine-pitch soldering ability

From water-soluble solder pastes to ultra-low residue, no-clean fluxes, Indium Corporation has an industry-proven portfolio of products that meet the current and evolving challenges encountered in fine-pitch SiP applications.

For more information on Indium Corporation’s materials for SiP or Indium3.2HF Solder Paste, go to www.indium.com/SiP or visit Indium Corporation’s booth 2412.

For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.