Indium Corporation will feature Indium8.9HF, a halogen-free, no-clean solder paste with excellent performance stability during printing, at the SMTA International Conference Sept. 27-Oct. 1 in Rosemont, Ill. 

Pb-free Indium8.9HF is perfectly suited for a wide variety of applications, including automotive, consumer and communications. This is due to its high print transfer efficiency and robust reflow process window capability. With reliable performance stability during usage, a clear, probe-testable flux residue, and a resilient oxidation barrier for strong head-in-pillow and graping resistance, Indium8.9HF is our best all-round performing solder paste.  

Indium8.9HF Solder Paste is part of Indium Corporation’s Pb-free series of solder pastes. The series was designed to provide multi-faceted performance characteristics, bringing the right balance of solder paste attributes tailored specifically to each manufacturing process. Every paste in the series was developed to optimize print performance and mitigate common defects faced by manufacturers of personal electronics, such as QFN voiding, head-in-pillow, and graping.

For more information about Indium8.9HF or the Indium Pb-free series of solder pastes, visit www.indium.com/indium8.9series or stop at Indium Corporation’s booth #430.

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, solar, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.