Indium Corporation will feature its reinforced solder alloy fabrications, InFORMS®, at PCIM Europe 2017, May 16-18, in Nuremberg, Germany.

Indium Corporation is redefining solder with its InFORMS solder preforms. InFORMS are a composite preform consisting of solder and a reinforcing matrix that, together, increase lateral strength and bondline co-planarity while improving thermal cycling reliability.

When InFORMS were used to solder a DBC to the baseplate of an IGBT, one study showed:

  • 4x improved thermal cycling reliability compared to a solder preform-only approach
  • 2x improved thermal cycling reliability compared to a solder preform + Al wirebond stitch approach
  • Reduced voiding (<1%)
  • Lower cost of ownership – as a drop-in replacement for a standard preform or solder paste, InFORMS require no additional process steps or equipment

For more information about InFORMS, visit www.indium.com/informs or see Indium Corporation at booth 7-315.

For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.